Spherical Silica Particles

Silica filler is used mainly as sealing filler for silicon chips of ICs. The silica filler has excellent properties, such as very low coefficient of thermal expansion, high fluidity, high packing density, and reduced damage to the material in contact when it is packed.

Features

- High purity (non crystal silica)
- High sphericity (high roundness)
- High flowability
- High filling density
- Low thermal expansion ratio
- Electrical insulation property
- Low water absorption property

Application

- Semiconductor encapsulation material filler
- Coating materials
- Filler material for various kinds of resin